群尚科技有限公司

產品介紹

陶瓷散熱基板 薄膜製程

LTCC Substrate

LTCC, low temperature co-fired ceramic, are monolithic, ceramic microelectronic devices that ceramic support structure and any conductive, resistive, and dielectric materials are fired in a kiln at the same time. The sintering temperature is less than 1000 °C.

LTCC substrates are capable of providing size and weight reduction, cost effective, and adapting to a variety of shapes and sizes as required.

Physical Properties:

Characteristic Value	Al2O3
Color	White
Density	3.2~3.5 g/cm3
Thermal Conductivity	2~3 W/mk
Coefficient of Thermal Expansion	6 x 10-6/℃ (25～300℃)
Dielectric Strength	＞15 KV/mm
Volume Resistivity	≧1014 Ω‧m (25℃)
Dielectric Constant	7~8 1MHz
Bending Strength	≧300 MPa

HTCC Substrate

HTCC, high temperature co-fired ceramic, packages generally consist of multi-layers of alumina oxide with tungsten and moly manganese metallization. The ceramic is fired at around 1600 °C. Compared to LTCC, HTCC has higher resistance conductive layers.

Features

• 1. Hermeticity
• 2. Harsh environment capability
• 3. Thermal conductivity
• 4. Greater devise density due to more circuit layers
• 5. Cost competitive
• 6. Design flexibility
• 7. Mechanical strength, rigidity and non-flex

For more information about LTCC / HTCC, please contact with us.